Substrat de paquet de FCCSP
(7)
Matériel de BT d'épaisseur du substrat 0.3mm de paquet vert de PBGA/CSP pour l'Assemblée d'IC
Prix: US 85-100 per square meter
MOQ: 1 square meter
Heure de livraison: 7-10 working days
Marque: Horexs
Souligner:Green CSP package substrate, BT CSP package substrate, BT PBGA package substrate
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electroni... Voir plus
➤ Visiter Site Internet
Fabrication de substrat de FCCSP soutenant la Chine
Prix: US 120-150 per square meter
MOQ: 1 square meter
Heure de livraison: 7-10 working days
Marque: Horexs
Souligner:Gold Plating Soldermask Antenna PCB, 0.1mm Antenna PCB, 0.1mm 4 Layer PCB
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,O... Voir plus
➤ Visiter Site Internet
semiconductor FCCSP Package Substrate manufacture
Prix: US 85-100 per square meter
MOQ: 1 square meter
Heure de livraison: 7-10 working days
Marque: Horexs
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Necl... Voir plus
➤ Visiter Site Internet
0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
Prix: US 85-100 per square meter
MOQ: 1 square meter
Heure de livraison: 7-10 working days
Marque: Horexs
Souligner:ENEPIG FCCSP package substrate, Buildup Types FCCSP package substrate, 0.3mm FCCSP substrate
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Voir plus
➤ Visiter Site Internet
BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
Prix: US 85-100 per square meter
MOQ: 1 square meter
Heure de livraison: 7-10 working days
Marque: Horexs
Souligner:Green Color FCCSP Package Substrate, Flip Chip FCCSP Package Substrate, BT FCCSP Substrate
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts st... Voir plus
➤ Visiter Site Internet
Soutien de production de substrat de paquet de FCCSP
Prix: US 85-100 per square meter
MOQ: 1 square meter
Heure de livraison: 7-10 working days
Marque: Horexs
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... Voir plus
➤ Visiter Site Internet
Soutien de production de substrat de paquet de Flip Chip CSP
Prix: US 85-100 per square meter
MOQ: 1 square meter
Heure de livraison: 7-10 working days
Marque: Horexs
Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF... Voir plus
➤ Visiter Site Internet