Équipement de moulage à semi-conducteurs
(25)
Système de moulage à semi-conducteurs à haute pression
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Water Cooling Semiconductor Processing Equipment, Water Cooling Semicon Molding System, High Pressure Semiconductor Processing Equipment
Semicon Molding System Product Detail: Product Name: Semiconductor Molding Equipment Energy Consumption: Low Control System: PLC Application: Semiconductor Industry Molding Method: Injection Molding Capacity: High Plasticizing Press Plasticizing Press Plasticizing Press PLC Control System ● The auto... Voir plus
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Équipement de moulage de semi-conducteurs de 1000 tonnes Dispositif d'étanchéité en plastique haute précision
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:1000 Tons Semiconductor Molding Equipment, Semiconductor Molding Equipment High Precision, semiconductor molding machine High Precision
Automatic Semiconductor Plastic seal Device FAQ: Q: What is the brand name of this product? A: The brand name of this product is TJIN. Q: What is the model number of this product? A: The model number of this product is 002. Q: Where is this product manufactured? A: This product is manufactured in Ch... Voir plus
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Équipement de moulage à semi-conducteurs entièrement automatique
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Fully Automatic Semiconductor Molding Equipment, Fully Automatic Semiconductor Molding machine
Fully Automatic Transfer Molding' Features ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansio... Voir plus
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Équipement d'emballage à semi-conducteurs à haut rendement
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Highly efficient Semiconductor Packaging Equipment, Highly efficient ic packaging Equipment
Semiconductor Packaging Equipment Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Voir plus
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Système d'encapsulation automatique de puce
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Auto Chip Encapsulation System, Auto Chip encapsulation equipment
Auto Chip Encapsulation System Packing and Shipping: Packaging and Shipping for Semiconductor Molding Equipment Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our customers. Each unit is packed in a sturdy wooden crate with foam padding to protect against any da... Voir plus
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Transfert de puces, moulage, équipement de fabrication de semi-conducteurs, refroidissement par eau
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Chip Transfer Molding semiconductor manufacturing equipment, Chip Transfer Molding semiconductor manufacturing machine, Semiconductor Manufacturing Equipment Water Cooling
Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology and features to ensure effici... Voir plus
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Équipement de moulage de semi-conducteurs fiable fonctionne sans heurts contrôlé par PLC
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Reliable Semiconductor Molding Equipment, Reliable semiconductor molding machine, PLC Controlled Semiconductor Molding Equipment
TJIN Semiconductor Molding Equipment Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art tec... Voir plus
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Équipement d'emballage de semi-conducteurs à haute productivité
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:High Productivity Semiconductor Packaging Equipment, High Productivity Chip Molding Device
Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; Semiconductor plastic seal... Voir plus
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Économies d'énergie équipement de moulage de semi-conducteurs moulage de transfert de semi-conducteurs
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Energy Saving Semiconductor Molding Equipment, Energy Saving semiconductor molding machine, Semicon Transfer Molding Equipment
Auto Semicon Transfer Molding Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology... Voir plus
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Industrie des semi-conducteurs équipement d'emballage de circuits intégrés système de moulage de puces automatisé
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Semiconductor Industry IC Packaging Equipment, Semiconductor Industry Chip Molding System, IC Packaging Equipment Automated
Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one -stop automatic packaging test. Product Description: Semiconductor Molding Equipment Th... Voir plus
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Équipement de moulage à puces à semi-conducteurs à haut rendement Système de moulage à puces 50/60 Hz
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:High Efficient Semiconductor Molding Equipment, High Efficient Chip Molding System, Semiconductor Molding Equipment 60Hz
Semiconductor Chip Molding System 【Features】 ● Semiconductor packaging equipment is also known as chip packaging equipment and IC packaging equipment, semiconductor MOLDING packaging equipment; ● Automatic packaging test chip, semiconductor device, IC and other products; ● Full servo control system,... Voir plus
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Machine de moulage à injection unique de semi-conducteurs, moulage par transfert entièrement automatique
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Single Injection semiconductor molding machine, Single Injection semiconductor fab equipment, Semiconductor Molding Machine Fully Automatic
Fully Automatic Transfer Molding 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; ● Full servo ... Voir plus
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Équipement de production de semi-conducteurs entièrement automatiques pour le moulage par injection
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Full Auto Semiconductor Production Equipment, Injection Molding Semiconductor Production Equipment, Injection Molding semiconductor fab equipment
Automatic Molding System Product Description: Semiconductor Molding Equipment Our Semiconductor Molding Equipment is designed specifically for the semiconductor industry and offers a fully automatic molding system with advanced control capabilities. With our state-of-the-art PLC control system, our ... Voir plus
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Équipement de moulage à semi-conducteurs de 90 kW
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:90KW Semiconductor Molding Equipment, Semicon Transfer Molding Device, 90KW semiconductor molding machine
Semicon Transfer Molding 【Performance parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm in length, 0.15-1.2mm thick; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length/diameter ... Voir plus
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Équipement de moulage de semi-conducteurs à haute productivité Système de moulage automatique de puces
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:High Productivity Semiconductor Molding Equipment, High Productivity Chip Molding System, Chip Molding Semiconductor Molding Equipment
Auto Chip Molding System Technical Parameters: Parameter Value Maintenance Easy Control System PLC Application Semiconductor Industry Capacity High Cycle Time Short Safety Features Advanced Molding Method Injection Molding Precision High Energy Consumption Low Pressure Control Precision Pressure Con... Voir plus
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Équipement de moulage à semi-conducteurs électrique Système d'encapsulation de semi-conducteurs
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Semiconductor Molding Equipment Semicon Encapsulation, Electric Powered Semiconductor Molding Equipment, Electric Powered semiconductor molding machine
Auto Semicon Encapsulation System Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Voir plus
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Système d'encapsulation de puce Équipement de fabrication de semi-conducteurs Énergie efficace
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Chip Encapsulation semiconductor fab equipment, Semiconductor Fab Equipment Energy Efficient, Chip Encapsulation System Energy Efficient
Auto Chip Encapsulation System Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Voir plus
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Machines de fabrication de puces semi-conducteurs certifiées ISO9001
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Auto Plasticizing Press Chip Manufacturing Machines, ISO9001 Semiconductor Chip Manufacturing Machines, ISO9001 chip manufacturing equipment
Auto Plasticizing Press Machine Product Detail: ● Full servo control system, PLC (Omron)+upper machine; ● Win10+15 -inch touch screen+touch keyboard; ● CCD image detection, feed anti -counter -anti -detection ● Standardized mold structure, convenient replacement; ● High -efficient ingredients, cakes... Voir plus
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Équipement de moulage de semi-conducteurs 380V 50Hz
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:Chip Plasticizing Press Semiconductor Molding Equipment, Chip Plasticizing Press semiconductor molding machine, Semiconductor Molding Equipment 380V
Chip Plasticizing Press Customization: TJIN Semiconductor Molding Equipment Customized Service Brand Name: TJIN Model Number: 002 Place of Origin: China Precision: High Capacity: High Maintenance: Easy Control System: PLC Safety Features: Advanced Our company, TJIN, specializes in providing customiz... Voir plus
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Machines de fabrication de semi-conducteurs hautement automatisées
Prix: Negotiable
MOQ: 1 set
Heure de livraison: 40 days
Marque: TJIN
Souligner:highly Automation semiconductor fabrication machines, highly Automation Semicon Molding Equipment
Auto Semicon Molding Equipment Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Voir plus
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