Structure du produit d'emballage au niveau des panneaux
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Façade de l'emballage au niveau du panneau vers le bas-EWLB Dissipation thermique élevée Fiabilité élevée
Prix: Negotiable
MOQ: Negotiable
Heure de livraison: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Voir plus
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L'emballage à niveau de panneau à ventilation (FOPLP) - Structure du produit (face vers le haut) - Bump de gaufre
Prix: Negotiable
MOQ: 3000pcs
Heure de livraison: 1 month
Marque: FZX Fan-Out Panel Level Packaging
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surf... Voir plus
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Emballage à l'échelle du panneau de ventilation (FOPLP) - Structure du produit (face vers le haut) - Boule en fil de fer
Prix: Negotiable
MOQ: 3000pcs
Heure de livraison: 1 month
Marque: FZX Fanout Process and Product
Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and... Voir plus
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Emballage au niveau du panneau de ventilation (FOPLP) Structure du produit Emballage intégré
Prix: Negotiable
MOQ: 3000pcs
Heure de livraison: 1 month
Marque: FZX
Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ; 2,While maintaining the original foot position design, it is much thinner an... Voir plus
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