Taille du panneau 310*320 mm Niveau du panneau QFN Faible résistance électrique
Prix: Negotiable
MOQ: Negotiable
Heure de livraison: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Voir plus
➤ Visiter Site Internet
Taille du panneau 310*320mm Puce MOS mince Silicium Faible consommation d'énergie
Prix: Negotiable
MOQ: 3000pcs
Heure de livraison: 1 month
Marque: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Voir plus
➤ Visiter Site Internet
Façade de l'emballage au niveau du panneau vers le bas-EWLB Dissipation thermique élevée Fiabilité élevée
Prix: Negotiable
MOQ: Negotiable
Heure de livraison: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Voir plus
➤ Visiter Site Internet
Produit GaN 310*320mm enveloppé en panneau de ventilation
Prix: Negotiable
MOQ: 3000pcs
Heure de livraison: 1 month
Marque: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Voir plus
➤ Visiter Site Internet
TGV haute résolution des couleurs Capacités de fonderie pour l'emballage de semi-conducteurs
Prix: Negotiable
MOQ: 10 panel
Heure de livraison: 1 month
Marque: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... Voir plus
➤ Visiter Site Internet
Un emballage adapté à diverses expériences de simulation d'emballage
Prix: Negotiable
MOQ: 3000pcs
Heure de livraison: 1 month
Marque: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Voir plus
➤ Visiter Site Internet