Expériences de simulation de l'emballage
(1)
Un emballage adapté à diverses expériences de simulation d'emballage
Prix: Negotiable
MOQ: 3000pcs
Heure de livraison: 1 month
Marque: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Voir plus
➤ Visiter Site Internet